热固耦合下裂隙产状对导热系数影响的模拟分析
渠成堃,周辉,任振群,程文武
Simulation analysis for influence of fracture occurrence on thermal conductivity under thermal-solid coupling
QU Cheng-kun,ZHOU Hui,REN Zhen-qun,CHENG Wen-wu
沈阳工业大学学报
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2017, (2): 219
-224
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DOI: 10.7688/j.issn.1000-1646.2017.02.18
