Simulation analysis for influence of fracture occurrence on thermal conductivity under thermal-solid coupling

QU Cheng-kun,ZHOU Hui,REN Zhen-qun,CHENG Wen-wu

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Journal of Shenyang University of Technology ›› 2017, Vol. 39 ›› Issue (2) : 219-224. DOI: 10.7688/j.issn.1000-1646.2017.02.18

Simulation analysis for influence of fracture occurrence on thermal conductivity under thermal-solid coupling

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{{article.zuoZheEn_L}}. {{article.title_en}}. {{journal.qiKanMingCheng_EN}}. 2017, 39(2): 219-224 https://doi.org/10.7688/j.issn.1000-1646.2017.02.18

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